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Dell Laptop BGA Rework Service
Dell laptop Chip level repair is a micro-soldering technique used to repair damaged or faulty chips on a laptop motherboard. This type of repair is often necessary when the laptop is not responding, has a black screen, or is experiencing other problems that are caused by a faulty chip.
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BGA Rework Service
A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs).
A Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board).
If you must use lead-tin solder paste with lead-free BGA packages, ensure that the reflow temperature is high enough to provide a reliable interconnection. A minimum peak temperature of 220°C is recommended, but a range of 225–245°C (for qualified components) is preferred.
